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USA-Canada Alliance to boost PCB manufacturing in North America

USA – Canada Alliance to bolster advanced packaging and PCB manufacturing in North America

USA - Canada alliance


In response to the joint statement made today by Canadian Prime Minister Justin Trudeau and US President Joe Biden, IPC’s John W. Mitchell, president and CEO, declares say :


The alliance for Advanced Packaging for Semiconductors and Printed Circuit Boards in North America, » including an additional $50 million in funding under the U.S. Defense Production Act for these purposes », is a partnership between the United States and Canada. The U.S. and Canada must invest in and promote the growth of the electronics manufacturing ecosystem, including printed circuit boards, integrated circuit substrates, and semiconductor assembly, in order to achieve our shared goals, » he continued. « A ‘silicon to systems’ approach must be taken or the region’s long-term innovation leadership and the promise of the CHIPS Act would be compromised. Today’s announcement is a significant step forward in the effort to revive the once-proud North American electronics manufacturing sector. The strengthening of the CHIPS Act is therefore felt as a result of this statement.


Following this alliance, the production capacity in USA and Canada will raise up for high performance PCB. Online analyzers and dosing units will be the key point for the success of quality boards.